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NTMS3P03R2
MAXIMUM RATINGS
Rating
Drain-to-Source Voltage
Gate-to-Source Voltage - Continuous
Thermal Resistance -
Junction-to-Ambient (Note 1)
Total Power Dissipation @ T A = 25 ° C
Continuous Drain Current @ 25 ° C
Continuous Drain Current @ 70 ° C
Pulsed Drain Current (Note 4)
Thermal Resistance -
Junction-to-Ambient (Note 2)
Total Power Dissipation @ T A = 25 ° C
Continuous Drain Current @ 25 ° C
Continuous Drain Current @ 70 ° C
Pulsed Drain Current (Note 4)
Thermal Resistance -
Junction-to-Ambient (Note 3)
Total Power Dissipation @ T A = 25 ° C
Continuous Drain Current @ 25 ° C
Continuous Drain Current @ 70 ° C
Pulsed Drain Current (Note 4)
Operating and Storage Temperature Range
Single Pulse Drain-to-Source Avalanche Energy - Starting T J = 25 ° C
(V DD = -30 Vdc, V GS = -4.5 Vdc, Peak I L = -7.5 Apk, L = 5 mH, R G = 25 W )
Maximum Lead Temperature for Soldering Purposes, 1/8 ″ from case for 10 seconds
Symbol
V DSS
V GS
R q JA
P D
I D
I D
I DM
R q JA
P D
I D
I D
I DM
R q JA
P D
I D
I D
I DM
T J , T stg
E AS
T L
Value
-30
± 20
171
0.73
-2.34
-1.87
-8.0
100
1.25
-3.05
-2.44
-12
62.5
2.0
-3.86
-3.1
-15
- 55 to +150
140
260
Unit
V
V
° C/W
W
A
A
A
° C/W
W
A
A
A
° C/W
W
A
A
A
° C
mJ
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Minimum FR-4 or G-10 PCB, t = steady state.
2. Mounted onto a 2 ″ square FR-4 Board (1 ″ sq. 2 oz Cu 0.06 ″ thick single sided), t = steady state.
3. Mounted onto a 2 ″ square FR-4 Board (1 ″ sq. 2 oz Cu 0.06 ″ thick single sided), t ≤ 10 seconds.
4. Pulse Test: Pulse Width = 300 m s, Duty Cycle = 2%.
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